| Non-VolatileContent (%) | 52 ± 3 |
| Solvent | n-ButanolXylene |
| Viscosity (cPs)25˚C – Brookfield | 1500 – 3000 |
| FreeFormaldehyde (%) | < 0.20 |
| WaterSolubility | Insoluble |
| XyleneSolubility | Soluble |
| Characteristics and Applications | High compatibility with epoxy based formulations and exhibits quick cure response and good adhesion to metal substrates. Applicable in Dipping enamels, Primer and General industrial baking formulations. |


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